Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796958 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-10-06 |
| 10777454 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-09-15 |
| 10767084 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more | 2020-09-08 |
| 10651086 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-05-12 |