Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Fernando A. Santos | 2020-08-11 |