Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840219 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Meng-Kai SHIH | 2020-11-17 |
| 10541198 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chang-Chi Lee, Chih-Pin Hung | 2020-01-21 |