Issued Patents 2020
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833296 | Thin film solid-state microbattery packaging | Qianwen Chen, John U. Knickerbocker, Bo Wen | 2020-11-10 |
| 10824822 | Magnetic tracking for medicine management | Rajeev Narayanan, Bo Wen | 2020-11-03 |
| 10687425 | Method of forming a plurality of electro-optical module assemblies | Paul S. Andry, Qianwen Chen, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-16 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-06-09 |
| 10679018 | Magnetic tracking for medicine management | Rajeev Narayanan, Bo Wen | 2020-06-09 |
| 10670656 | Integrated electro-optical module assembly | Paul S. Andry, Qianwen Chen, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-02 |
| 10658182 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-05-19 |
| 10651507 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2020-05-12 |
| 10651036 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-05-12 |
| 10638945 | Transdermal sensing probes and smart patch systems using same | Yang Liu, Steven L. Wright | 2020-05-05 |
| 10636837 | Solution deposited magnetically guided chiplet displacement | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2020-04-28 |
| 10638613 | Method of forming a plurality of electro-optical module assemblies | Paul S. Andry, Qianwen Chen, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-04-28 |
| 10637101 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2020-04-28 |
| 10630592 | Routing method, related device, and system | Shihai Hu, Peng Ma | 2020-04-21 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |
| 10573625 | Vertical light emitting diode with magnetic back contact | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2020-02-25 |
| 10559555 | Micro-LED array transfer | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2020-02-11 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah | 2020-01-28 |