Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10648096 | Electrolyte, method of forming a copper layer and method of forming a chip | Werner Robl, Michael Melzl, Bernhard Weidgans, Franziska Haering | 2020-05-12 |
| 10651140 | Semiconductor device with metal structure electrically connected to a conductive structure | Franziska Haering, Hans-Joachim Schulze, Bernhard Weidgans | 2020-05-12 |