Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784297 | Chip scale package structures | Yu-Min Lin | 2020-09-22 |
| 10743411 | Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component | Ho-Chieh Yu, Chen-Cheng Liao, Chun Lin, Hsiao-Ming Chang, Jing-Yao Chang | 2020-08-11 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Kuo-Shu Kao, Fang-Jun Leu, Hsin-Han Lin, Chih-Ming Tzeng +2 more | 2020-06-02 |
| 10622274 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2020-04-14 |