Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Hsin-Han Lin, Chih-Ming Tzeng +2 more | 2020-06-02 |
| 10622274 | Chip package | Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2020-04-14 |