Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10743411 | Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component | Ho-Chieh Yu, Chen-Cheng Liao, Chun Lin, Jing-Yao Chang, Tao-Chih Chang | 2020-08-11 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Tao-Chih Chang, Kuo-Shu Kao, Fang-Jun Leu, Hsin-Han Lin +2 more | 2020-06-02 |