Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10743411 | Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component | Chen-Cheng Liao, Chun Lin, Hsiao-Ming Chang, Jing-Yao Chang, Tao-Chih Chang | 2020-08-11 |