Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Luc Guerin, Steve Whitehead, Jean Audet, Richard Langlois +3 more | 2020-09-22 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |