Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet, Richard Langlois +3 more | 2020-09-22 |
FA
Francois Arguin
Overall (2020): #472,976 of 565,922Top 85%
1
Patents 2020