Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet, Richard Langlois +3 more | 2020-09-22 | $3,040,000 |