Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet +3 more | 2020-09-22 |
| 10679966 | Gallium liquid metal embrittlement for device rework | David Danovitch, Yolande Elodie Nguena Dongmo | 2020-06-09 |
| 10559549 | Gallium liquid metal embrittlement for device rework | David Danovitch, Yolande Elodie Nguena Dongmo | 2020-02-11 |