Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872851 | Semiconductor package | Eun Jin Kim | 2020-12-22 |
| 10790239 | Semiconductor package and board for mounting the same | Jae Hyun Lim, Chul Kyu KIM, Kyung Moon JUNG, Yoon Seok Seo | 2020-09-29 |
| 10770403 | Fan-out semiconductor package | Mi-Ja Han, Seong Chan PARK | 2020-09-08 |
| 10756023 | Semiconductor package | Hyung Joon Kim | 2020-08-25 |
| 10748833 | Fan-out semiconductor package | Seong Chan PARK, Sang Hyun KWON, Hye Lee KIM, Seung On KANG | 2020-08-18 |
| 10734342 | Semiconductor package for reducing stress to redistribution via | Seok Hwan Kim, Kyung Ho Lee, Kyung Moon JUNG | 2020-08-04 |
| 10714440 | Fan-out semiconductor package | Kyung Moon JUNG, Seok Hwan Kim, Kyung Ho Lee, Kang Heon Hur | 2020-07-14 |
| 10672719 | Fan-out semiconductor package | Kang Heon Hur, Jong-Man Kim, Kyung Ho Lee | 2020-06-02 |
| 10672727 | Semiconductor package providing protection from electrical noise | Hyung Joon Kim, Jung Ho Shim, Jun Young Won | 2020-06-02 |
| 10607914 | Semiconductor package | Jae Hyun Lim, Yoon Seok Seo, Sang Jong Lee | 2020-03-31 |
| 10600679 | Fan-out semiconductor package | Mi-Ja Han, Dae-Hyun Park | 2020-03-24 |
| 10580759 | Fan-out semiconductor package | Eun Jung Jo, Yoon Seok Seo | 2020-03-03 |
| 10573589 | Semiconductor package | Eun Jin Kim | 2020-02-25 |
| 10535643 | Connection system of semiconductor packages using a printed circuit board | Yun Tae Lee, Hyung Joon Kim | 2020-01-14 |