Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10871496 | Composite compound comprising upconverting nanoparticle and specific receptor | Min Gon Kim, Hyo-Young Mun | 2020-12-22 |
| 10734324 | Fan-out semiconductor package including stacked chips | Yun Tae Lee, Han Kim | 2020-08-04 |
| 10667419 | Manufacturing method of an electronic component module | Do Jae Yoo, Jae Hyun Lim | 2020-05-26 |
| 10580759 | Fan-out semiconductor package | Han KIM, Yoon Seok Seo | 2020-03-03 |