Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840228 | Semiconductor package | Han Kim, Hyung Joon Kim | 2020-11-17 |
| 10734324 | Fan-out semiconductor package including stacked chips | Eun Jung Jo, Han Kim | 2020-08-04 |
| 10734335 | Electronic component package | Moon Il Kim | 2020-08-04 |
| 10535643 | Connection system of semiconductor packages using a printed circuit board | Han KIM, Hyung Joon Kim | 2020-01-14 |