Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790239 | Semiconductor package and board for mounting the same | Jae Hyun Lim, Chul Kyu KIM, Han KIM, Yoon Seok Seo | 2020-09-29 |
| 10734342 | Semiconductor package for reducing stress to redistribution via | Seok Hwan Kim, Han KIM, Kyung Ho Lee | 2020-08-04 |
| 10714440 | Fan-out semiconductor package | Han KIM, Seok Hwan Kim, Kyung Ho Lee, Kang Heon Hur | 2020-07-14 |
| 10700110 | Fan-out sensor package | Jae Hyun Lim, Yoon Seok Seo, Eun Jin Kim | 2020-06-30 |