Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756008 | Organic interposer and method for manufacturing organic interposer | Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori Ejiri | 2020-08-25 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2020-08-18 |
| 10575402 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | Shinichiro Abe, Tomonori Minegishi, Kazuyuki MITSUKURA, Masaya TOBA | 2020-02-25 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2020-02-18 |