Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10674612 | Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer | Tomoaki Shibata, Hanako Yori, Hidenori Abe, Takashi Masuko, Shunsuke Otake | 2020-06-02 |
| 10575402 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | Shinichiro Abe, Kazuhiko Kurafuchi, Kazuyuki MITSUKURA, Masaya TOBA | 2020-02-25 |