Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Kazuhiko Kurafuchi, Yoshinori Ejiri | 2020-08-18 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Yuki KAWANA | 2020-02-18 |