Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10787361 | Sensor device with flip-chip die and interposer | Stanley Job Doraisamy, Norazham Mohd Sukemi | 2020-09-29 |
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Lidong Zhang, Kendall D. Phillips, Quan Chen | 2020-08-04 |
| 10692802 | Flexible semiconductor device with graphene tape | You Ge, Zhijie Wang | 2020-06-23 |