Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Lidong Zhang, Kendall D. Phillips, Quan Chen, Meng Kong Lye | 2020-08-04 |
| 10734312 | Packaged integrated circuit having stacked die and method for therefor | Kim R. Gauen | 2020-08-04 |
| 10734327 | Lead reduction for improved creepage distance | Mariano Layson Ching, Jr., Jinmei Liu, Yit Meng Lee, Allen Marfil Descartin | 2020-08-04 |