Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847449 | Lead frame with selective patterned plating | Meijiang Song, Allen Marfil Descartin, Mariano Layson Ching, Jr., Jun Li | 2020-11-24 |
| 10810169 | Hybrid file system architecture, file storage, dynamic migration, and application thereof | Yeh-Ching Chung, Yongwei Wu | 2020-10-20 |
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Kendall D. Phillips, Quan Chen, Meng Kong Lye | 2020-08-04 |