Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Lidong Zhang, Quan Chen, Meng Kong Lye | 2020-08-04 |