Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10874016 | Method of manufacturing physical structure for high frequency signal transmission | HSIAO-TING HSU | 2020-12-22 |
| 10863620 | Bendable circuit board and method for manufacturing the same | Hao Zhong, Biao Li, Man-Zhi Peng | 2020-12-08 |
| 10849229 | Printed circuit board and method for manufacturing the same | RUI-WU LIU, Lei Zhou, Man-Zhi Peng | 2020-11-24 |
| 10822522 | Modified polyimide compound, resin composition and polyimide film | Mao-Feng Hsu, SHOU-JUI HSIANG, NAN-KUN HUANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2020-11-03 |
| 10791625 | Method for manufacturing flexible printed circuit board | XIAN-QIN HU | 2020-09-29 |
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2020-08-18 |
| 10660218 | Method of manufacturing multilayer circuit board | XIAN-QIN HU, LI-KUN LIU, Yan-Lu Li | 2020-05-19 |
| 10660210 | Flexible circuit board | FU-YUN SHEN, HSIAO-TING HSU | 2020-05-19 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2020-05-19 |
| 10653015 | Multilayer circuit board and method of manufacturing the same | XIAN-QIN HU, LI-KUN LIU, Yan-Lu Li | 2020-05-12 |
| 10575406 | Method of making flexible circuit board | FU-YUN SHEN, HSIAO-TING HSU | 2020-02-25 |
| 10533811 | Heat dissipation device | XIAN-QIN HU, FU-YUN SHEN | 2020-01-14 |