Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | Cong Lei, MING-JAAN HO, HSIAO-TING HSU | 2020-08-18 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | Cong Lei, MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |
| 10660210 | Flexible circuit board | MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |
| 10575406 | Method of making flexible circuit board | MING-JAAN HO, HSIAO-TING HSU | 2020-02-25 |
| 10533811 | Heat dissipation device | XIAN-QIN HU, MING-JAAN HO | 2020-01-14 |