Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU | 2020-08-18 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |