Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844174 | Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same | SHOU-JUI HSIANG, YU-WEN KAO, SZU-HSIANG SU | 2020-11-24 |
| 10822522 | Modified polyimide compound, resin composition and polyimide film | MING-JAAN HO, Mao-Feng Hsu, SHOU-JUI HSIANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2020-11-03 |