Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844174 | Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same | NAN-KUN HUANG, SHOU-JUI HSIANG, YU-WEN KAO | 2020-11-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844174 | Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same | NAN-KUN HUANG, SHOU-JUI HSIANG, YU-WEN KAO | 2020-11-24 |