Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Daisuke Soma +1 more | 2019-08-13 |
| 10370771 | Method of manufacturing cu core ball | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato | 2019-08-06 |
| 10322472 | Cu core ball, solder paste, formed solder, Cu core column, and solder joint | Takahiro Hattori, Daisuke Soma, Isamu Sato | 2019-06-18 |
| 10173287 | Solder material, solder joint, and method of manufacturing the solder material | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2019-01-08 |