Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma +1 more | 2019-08-13 |
| 10358395 | Method for producing butadiene and device for producing butadiene | Toshihito Miyama | 2019-07-23 |