Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Shigeki Kondo, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma +1 more | 2019-08-13 |
| 10322472 | Cu core ball, solder paste, formed solder, Cu core column, and solder joint | Daisuke Soma, Takahiro Roppongi, Isamu Sato | 2019-06-18 |