Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma +1 more | 2019-08-13 |
| 10370771 | Method of manufacturing cu core ball | Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2019-08-06 |
| 10357852 | Flux with dibasic acid mixture | Yasuhiro Kajikawa, Yoshinori Hiraoka, Takashi Hagiwara | 2019-07-23 |
| 10173287 | Solder material, solder joint, and method of manufacturing the solder material | Takahiro Roppongi, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2019-01-08 |