Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma +1 more | 2019-08-13 |