Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361170 | Semiconductor package | Sungeun Pyo, Jongbo Shim, Chajea Jo, Sang-Uk Han | 2019-07-23 |
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2019-03-05 |
| 10199319 | Printed circuit board and semiconductor package including the same | Jong Bo Shim, Sang-Uk Han, Yun-Seok Choi | 2019-02-05 |
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Sunkyoung Seo, Chajea Jo, Taeje Cho | 2019-01-29 |