Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510737 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2019-12-17 |
| 10361170 | Semiconductor package | Sungeun Pyo, Jongbo Shim, Ji Hwang Kim, Sang-Uk Han | 2019-07-23 |
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Sunkyoung Seo, Ji Hwang Kim, Taeje Cho | 2019-01-29 |
| 10186500 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Taeje Cho | 2019-01-22 |