Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Sunkyoung Seo, Chajea Jo, Ji Hwang Kim | 2019-01-29 |
| 10186500 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Chajea Jo | 2019-01-22 |