Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Chajea Jo, Ji Hwang Kim, Taeje Cho | 2019-01-29 |
SS
Sunkyoung Seo
Overall (2019): #256,543 of 560,194Top 50%
1
Patents 2019