Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Gun Lee, Ji Hwan Hwang, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |
| 10373935 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2019-08-06 |
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Jong Bo Shim, Won-Il Lee | 2019-03-05 |