Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Ji Hwan Hwang, Cha-Jea Jo, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Ji Hwan Hwang, Cha-Jea Jo, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |