Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Gun Lee, Cha-Jea Jo, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |
JH
Ji Hwan Hwang
Overall (2019): #417,139 of 560,194Top 75%
1
Patents 2019