Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366906 | Electronic package and its package substrate | Hsien-Ming Tsai | 2019-07-30 |
| 10347575 | Package substrate and its fabrication method | Shih-Ping Hsu, Pao-Hung Chou, Chi-Feng Peng | 2019-07-09 |
| 10278282 | Substrate structure and manufacturing method thereof | Hsien-Ming Tsai | 2019-04-30 |