Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483194 | Interposer substrate and method of fabricating the same | Shih-Ping Hsu | 2019-11-19 |
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Shih-Ping Hsu, Chi-Feng Peng | 2019-07-09 |