Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Shih-Ping Hsu, Pao-Hung Chou | 2019-07-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Shih-Ping Hsu, Pao-Hung Chou | 2019-07-09 |