Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483232 | Method for fabricating bump structures on chips with panel type process | Che-Wei Hsu, Tung-Yao Kuo | 2019-11-19 |
| 10483194 | Interposer substrate and method of fabricating the same | Pao-Hung Chou | 2019-11-19 |
| 10475752 | Semiconductor package structure and method of making the same | Che-Wei Hsu | 2019-11-12 |
| 10475765 | Interposer substrate and method for manufacturing the same | Che-Wei Hsu, Ching-Chieh Chang, Chao-Chung Tseng | 2019-11-12 |
| 10361160 | Package structure and its fabrication method | — | 2019-07-23 |
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Pao-Hung Chou, Chi-Feng Peng | 2019-07-09 |
| 10283442 | Interposer substrate and method of fabricating the same | Che-Wei Hsu | 2019-05-07 |
| 10269841 | Sensor package and method of manufacturing the same | Che-Wei Hsu | 2019-04-23 |
| 10204865 | Electronic package and conductive structure thereof | Chu-Chin Hu | 2019-02-12 |