Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366906 | Electronic package and its package substrate | Chun-Hsien Yu | 2019-07-30 |
| 10278282 | Substrate structure and manufacturing method thereof | Chun-Hsien Yu | 2019-04-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366906 | Electronic package and its package substrate | Chun-Hsien Yu | 2019-07-30 |
| 10278282 | Substrate structure and manufacturing method thereof | Chun-Hsien Yu | 2019-04-30 |