Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461061 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2019-10-29 |
| 10424553 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Owen R. Fay | 2019-09-24 |
| 10297577 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2019-05-21 |