Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483221 | 3DI solder cup | — | 2019-11-19 |
| 10446486 | Multi-die inductors with coupled through-substrate via cores | — | 2019-10-15 |
| 10424553 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar | 2019-09-24 |