Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461061 | Apparatuses and methods for semiconductor die heat dissipation | Sameer S. Vadhavkar, Anilkumar Chandolu | 2019-10-29 |
| 10431519 | Carrier removal by use of multilayer foil | James M. Derderian, Andrew M. Bayless | 2019-10-01 |
| 10424531 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2019-09-24 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Shijian Luo +3 more | 2019-01-01 |