Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461061 | Apparatuses and methods for semiconductor die heat dissipation | Sameer S. Vadhavkar, Xiao Li | 2019-10-29 |
| 10276529 | Semiconductor devices including conductive pillars | Kenneth N. Hagen | 2019-04-30 |
| 10192852 | Interconnect structure with redundant electrical connectors and associated systems and methods | — | 2019-01-29 |