Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10215500 | Semiconductor device assembly with vapor chamber | Jian Li | 2019-02-26 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2019-01-01 |